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CM1215
PACKAGE DIMENSIONS
SOT ? 23 3 ? Lead (TO ? 236AA)
CASE 419AH ? 01
ISSUE O
C
DETAIL Z
C
3X b
E1
0.05
A1
e
1
D
3
2
e
E
A
SEATING
PLANE
c
L
M
DETAIL Z
L2
GAUGE
PLANE
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE. DIMENSIONS D AND E1 ARE
DETERMINED AT DATUM H.
5. PIN ONE INDICATOR MUST BE LOCATED IN THE IN-
DICATED ZONE.
MILLIMETERS
DIM MIN MAX
A 0.75 1.17
A1 0.05 0.15
b 0.30 0.50
c 0.08 0.20
D 2.80 3.05
E 2.10 2.64
E1 1.20 1.40
e 0.95 BSC
L 0.40 0.60
L2 0.25 BSC
M 0 ° 8 °
RECOMMENDED
SOLDERING FOOTPRINT*
3X
0.56
2.74
3X
0.82
0.95
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
6
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